EP1S25F672C6ES
EP1S25F672C6ES
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rohs

Altera Corporation

EP1S25F672C6ES


EP1S25F672C6ES
F53-EP1S25F672C6ES
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, 35 X 35 MM, 1.27 MM PITCH, BGA-672
35 X 35 MM, 1.27 MM PITCH, BGA-672

EP1S25F672C6ES ECAD Model


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EP1S25F672C6ES Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Transferred
Supply Voltage-Nom 1.5 V
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.425 V
JESD-30 Code S-PBGA-B672
Qualification Status Not Qualified
JESD-609 Code e0
Operating Temperature-Max 85 °C
Number of Terminals 672
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer ALTERA CORP
Part Package Code BGA
Package Description 35 X 35 MM, 1.27 MM PITCH, BGA-672
Pin Count 672
Reach Compliance Code compliant
HTS Code 8542.39.00.01

EP1S25F672C6ES Datasheet Download


EP1S25F672C6ES Overview



The chip model EP1S25F672C6ES is a highly advanced integrated circuit that offers a range of features and benefits to users. It is designed to meet the needs of a variety of applications, including networks, intelligent systems, and other embedded systems. This chip model is an ideal solution for those who are looking to maximize efficiency and performance while minimizing costs.


One of the major advantages of the chip model EP1S25F672C6ES is its low power consumption. It is capable of operating at very low voltages and is highly efficient, making it suitable for a variety of applications. Its advanced features also allow for high-speed data transmission, making it an ideal choice for networks and other embedded systems. Additionally, its low power consumption makes it a great choice for those who are looking to reduce their energy costs.


The demand for the chip model EP1S25F672C6ES is expected to grow significantly in the coming years, as more and more applications require its advanced features. With its low power consumption and high-speed data transmission capabilities, it is expected to be used in a variety of applications, from networks to intelligent systems. It is also expected to be used in the era of fully intelligent systems, as its advanced features will be essential for the development of such systems.


In terms of product description and specific design requirements, the chip model EP1S25F672C6ES is designed to be used in a wide range of applications. Its features include a low power consumption, high-speed data transmission, and a variety of other features that make it suitable for a variety of applications. Additionally, it is designed to be compatible with a variety of operating systems, making it an ideal choice for those who are looking to maximize efficiency and performance.


In addition to the product description and design requirements, there are also a number of case studies and precautions that should be taken into account when using the chip model EP1S25F672C6ES. For example, users should be aware of the potential risks associated with using the chip, such as the possibility of data corruption or system crashes. Additionally, users should also be aware of the potential for interference with other devices, as well as the potential for data leakage.


Overall, the chip model EP1S25F672C6ES is a highly advanced integrated circuit that offers a range of features and benefits to users. With its low power consumption, high-speed data transmission, and a variety of other features, it is expected to be a popular choice for networks, intelligent systems, and other embedded systems in the coming years. Additionally, its design requirements and case studies should be taken into account when using the chip, as well as any potential risks associated with its use.



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