EP1S25F1020I7
EP1S25F1020I7
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rohs

Altera Corporation

EP1S25F1020I7


EP1S25F1020I7
F53-EP1S25F1020I7
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, 33 X 33 MM, 1 MM PITCH, FBGA-1020
BGA

EP1S25F1020I7 ECAD Model


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EP1S25F1020I7 Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Active
Supply Voltage-Nom 1.5 V
Number of Inputs 702
Number of Outputs 702
Number of Logic Cells 25660
Number of CLBs 2566
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Power Supplies 1.5,1.5/3.3 V
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.425 V
JESD-30 Code S-PBGA-B1020
Qualification Status Not Qualified
JESD-609 Code e0
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Number of Terminals 1020
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1020,31X31,50
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 33 mm
Length 33 mm
Ihs Manufacturer INTEL CORP
Package Description 33 X 33 MM, 1 MM PITCH, FBGA-1020
Reach Compliance Code compliant
HTS Code 8542.39.00.01

EP1S25F1020I7 Overview



The chip model EP1S25F1020I7 is a high-performance FPGA (Field Programmable Gate Array) chip developed by Altera. It is designed to meet the needs of high-speed, high-performance applications in the fields of embedded systems, communications, and industrial control. The chip has a wide range of features and is capable of handling a variety of tasks.


The EP1S25F1020I7 chip has several advantages over other FPGA chips. It is capable of handling high-speed data rates of up to 200 Mbps, making it ideal for applications where speed and reliability are important. The chip also has a high level of integration, allowing it to control multiple functions simultaneously. Additionally, the chip has a low power consumption and is capable of operating at temperatures ranging from -40°C to +85°C.


The EP1S25F1020I7 chip is expected to see increased demand in the future due to its high performance and low power consumption. It is ideal for applications in the fields of communications, embedded systems, and industrial control, and is increasingly being used by companies in these industries. The chip is also expected to be used in advanced communication systems due to its high-speed data rate and its ability to handle multiple functions simultaneously.


The EP1S25F1020I7 chip has a set of specific design requirements that must be met in order for it to function correctly. The chip is designed to have a maximum of 2520 logic elements and a maximum of 8192 bits of RAM. Additionally, the chip must be able to handle multiple clock speeds and must be able to support multiple I/O standards.


The EP1S25F1020I7 chip has been successfully used in a variety of applications. For example, the chip has been used in a system for controlling the speed of a motor, as well as in a system for controlling the temperature of a room. In both cases, the chip was able to handle the task with ease and reliability.


When using the EP1S25F1020I7 chip, there are a few precautions that must be taken. The chip is sensitive to static electricity and can be damaged if not handled properly. Additionally, the chip should not be exposed to temperatures above 85°C as this can cause permanent damage. Finally, it is important to ensure that the chip is properly connected to the power supply and that all connections are secure.


Overall, the EP1S25F1020I7 chip is a high-performance FPGA chip that is well suited for a variety of applications. It is expected to see increased demand in the future due to its high performance and low power consumption. The chip is designed to have a maximum of 2520 logic elements and a maximum of 8192 bits of RAM, and is capable of handling multiple clock speeds and I/O standards. When using the chip, it is important to take the necessary precautions to ensure that it is not damaged by static electricity or exposed to temperatures above 85°C.



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