Altera Corporation
EP1S25B672I7
EP1S25B672I7 ECAD Model
EP1S25B672I7 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 706 | |
| Number of Outputs | 706 | |
| Number of Logic Cells | 25660 | |
| Number of CLBs | 2566 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Power Supplies | 1.5,1.5/3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B672 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Number of Terminals | 672 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA672,26X26,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | 35 X 35 MM, 1.27 MM PITCH, BGA-672 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP1S25B672I7 Overview
Chip model EP1S25B672I7 is a high-performance, low-power, field-programmable gate array (FPGA) device. It is designed to provide customers with the flexibility to customize their hardware designs. The chip model EP1S25B672I7 has the ability to process complex algorithms and data-intensive applications, making it an ideal choice for a variety of applications.
The EP1S25B672I7 chip model is equipped with a variety of features, including support for high-speed serial transceivers, embedded memory blocks, and advanced logic blocks. It also provides a wide range of I/O options, allowing for a variety of connectivity options. The chip model also supports a wide range of applications, including embedded systems, industrial control, consumer electronics, and medical applications.
When it comes to industry trends, the EP1S25B672I7 chip model is designed to meet the needs of the industry. It is designed to provide customers with the flexibility to customize their hardware designs, allowing them to meet the needs of their specific applications. The chip model also supports the latest technologies, such as 5G, IoT, and AI, making it an ideal choice for the future of communications.
The EP1S25B672I7 chip model is designed to be used in a variety of applications, including networks, intelligent systems, and the era of fully intelligent systems. It is capable of providing the necessary features and performance for these applications, making it an ideal choice for the future of communications. The chip model also provides the necessary support for advanced communication systems, making it an ideal choice for a variety of applications.
In conclusion, the EP1S25B672I7 chip model is an ideal choice for a variety of applications. It is designed to provide customers with the flexibility to customize their hardware designs, allowing them to meet the needs of their specific applications. The chip model also supports the latest technologies, such as 5G, IoT, and AI, making it an ideal choice for the future of communications. It is capable of providing the necessary features and performance for networks, intelligent systems, and the era of fully intelligent systems.
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1,995 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||