Altera Corporation
EP1S20B672I6
EP1S20B672I6 ECAD Model
EP1S20B672I6 Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 586 | |
| Number of Outputs | 586 | |
| Number of Logic Cells | 18460 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Power Supplies | 1.5,1.5/3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B672 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Peak Reflow Temperature (Cel) | 220 | |
| Number of Terminals | 672 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA672,26X26,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | ALTERA CORP | |
| Package Description | BGA, BGA672,26X26,50 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | BGA | |
| Pin Count | 672 |
EP1S20B672I6 Datasheet Download
EP1S20B672I6 Overview
The chip model EP1S20B672I6 is a device that is designed to provide a variety of functions for a variety of applications. It is a single-chip field-programmable gate array (FPGA) that combines logic, memory, and analog components into a single device. It is designed to be used in a wide range of applications, from low-power embedded systems to large-scale industrial systems.
The chip model EP1S20B672I6 is designed to be used in a wide range of industries, including telecommunications, networking, automotive, medical, and industrial automation. It is designed to provide a high level of performance, flexibility, and scalability. It can be used in a variety of applications, including embedded systems, high-speed communication systems, and large-scale industrial systems.
The chip model EP1S20B672I6 is designed to be able to support a variety of technologies, including high-speed Ethernet, Gigabit Ethernet, and Fibre Channel. It is also designed to be able to support advanced communication systems, such as Wi-Fi, Bluetooth, and Zigbee. It is also designed to be able to support a variety of intelligent scenarios, such as machine learning and artificial intelligence.
The chip model EP1S20B672I6 is designed to be able to be upgraded to support new technologies as they become available. It is designed to be able to be used in the future in a variety of intelligent scenarios, such as the Internet of Things (IoT) and the fully intelligent systems of the future. It is also designed to be able to be used in a variety of networks, including 5G and beyond.
The chip model EP1S20B672I6 is designed to be able to provide a wide range of functions and capabilities. It is designed to be able to be used in a variety of applications, from low-power embedded systems to large-scale industrial systems. It is also designed to be able to be used in a variety of intelligent scenarios, such as machine learning and artificial intelligence. It is also designed to be able to be upgraded to support new technologies as they become available, making it a versatile and powerful device.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||