Altera Corporation
EP1K50FI256-3
EP1K50FI256-3 ECAD Model
EP1K50FI256-3 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Propagation Delay | 12.5 ns | |
| Number of Inputs | 186 | |
| Number of Outputs | 186 | |
| Number of Logic Cells | 2880 | |
| Number of Dedicated Inputs | 6 | |
| Number of I/O Lines | 186 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 6 DEDICATED INPUTS, 186 I/O | |
| Output Function | REGISTERED | |
| Power Supplies | 2.5,2.5/3.3 V | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 220 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 2.1 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Package Description | BGA, BGA256,16X16,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | BGA | |
| Pin Count | 256 |
EP1K50FI256-3 Datasheet Download
EP1K50FI256-3 Overview
The chip model EP1K50FI256-3 is a powerful and versatile integrated circuit, designed to provide solutions for a wide range of applications. It is capable of supporting a variety of network protocols and can be used in a variety of intelligent scenarios. The chip model EP1K50FI256-3 is an ideal choice for the development of the future intelligent systems.
The EP1K50FI256-3 chip model is a highly integrated circuit, containing a wide range of features, such as a high-performance central processing unit, a large memory capacity, a wide range of communication protocols, and a variety of I/O ports. It is designed to meet the requirements of a wide range of applications, including network communication, data processing, and intelligent control. The chip model is designed for high performance and low power consumption, making it suitable for use in the development of future intelligent systems.
The EP1K50FI256-3 chip model is designed for use in networks, and can be used to support a variety of intelligent scenarios. It can be used for data processing, artificial intelligence, and machine learning applications. The chip model is also capable of supporting a variety of communication protocols, including Wi-Fi, Bluetooth, and Zigbee. In addition, the chip model is capable of providing a variety of I/O ports, making it suitable for use in the development of future intelligent robots.
In order to use the EP1K50FI256-3 chip model effectively, it is important to understand the product description and specific design requirements. It is also important to consider the actual case studies and precautions that are associated with the use of the chip model. It is essential to understand the technical talents that are required to use the chip model effectively.
In conclusion, the EP1K50FI256-3 chip model is a powerful and versatile integrated circuit, designed to provide solutions for a wide range of applications. It is capable of supporting a variety of network protocols and can be used in a variety of intelligent scenarios. The chip model is an ideal choice for the development of the future intelligent systems, and can be used for the development and popularization of future intelligent robots. In order to use the chip model effectively, it is important to understand the product description and specific design requirements, as well as the actual case studies and precautions that are associated with the use of the chip model.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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