Altera Corporation
EP1K30FI256-3
EP1K30FI256-3 ECAD Model
EP1K30FI256-3 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Propagation Delay | 12.5 ns | |
| Number of Inputs | 171 | |
| Number of Outputs | 171 | |
| Number of Logic Cells | 1728 | |
| Number of Dedicated Inputs | 6 | |
| Number of I/O Lines | 171 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 6 DEDICATED INPUTS, 171 I/O | |
| Output Function | REGISTERED | |
| Power Supplies | 2.5,2.5/3.3 V | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 220 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 2.1 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Package Description | BGA, BGA256,16X16,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | BGA | |
| Pin Count | 256 |
EP1K30FI256-3 Datasheet Download
EP1K30FI256-3 Overview
The chip model EP1K30FI256-3 is a powerful tool for high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language, making it an ideal choice for those who need to develop high-performance applications.
The industry trends for the chip model EP1K30FI256-3 are constantly changing, and the future development of related industries will depend on the specific technologies that are needed. This means that the application environment may require the support of new technologies in order to remain relevant in the future.
The chip model EP1K30FI256-3 can be used in the development and popularization of future intelligent robots, as long as the right technical talents are employed. Those with experience in HDL language will be able to use the model effectively, as well as those with knowledge of digital signal processing, embedded processing, and image processing. Furthermore, those with experience in robotics and artificial intelligence will also be well-suited to work with the chip model EP1K30FI256-3.
Overall, the chip model EP1K30FI256-3 is a powerful tool that can be used in a variety of applications, from digital signal processing to robotics. Those with the right technical skills will be able to use the model effectively, and will be well-suited to the application environment of the future.
You May Also Be Interested In
4,324 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||