EP1K30FI256-1
EP1K30FI256-1
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rohs

Altera Corporation

EP1K30FI256-1


EP1K30FI256-1
F53-EP1K30FI256-1
Active
LOADABLE PLD, 8 ns, CMOS, BGA, BGA256,16X16,40
BGA, BGA256,16X16,40

EP1K30FI256-1 ECAD Model


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EP1K30FI256-1 Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 2.5 V
Propagation Delay 8 ns
Number of Inputs 171
Number of Outputs 171
Number of Logic Cells 1728
Number of Dedicated Inputs 6
Number of I/O Lines 171
Programmable Logic Type LOADABLE PLD
Temperature Grade INDUSTRIAL
Package Shape SQUARE
Technology CMOS
Organization 6 DEDICATED INPUTS, 171 I/O
Clock Frequency-Max 90 MHz
Output Function REGISTERED
Power Supplies 2.5,2.5/3.3 V
Supply Voltage-Max 2.625 V
Supply Voltage-Min 2.375 V
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 220
Number of Terminals 256
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA256,16X16,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 17 mm
Length 17 mm
Seated Height-Max 2.1 mm
Ihs Manufacturer ALTERA CORP
Reach Compliance Code compliant
HTS Code 8542.39.00.01
Part Package Code BGA
Package Description BGA, BGA256,16X16,40
Pin Count 256

EP1K30FI256-1 Datasheet Download


EP1K30FI256-1 Overview



The chip model EP1K30FI256-1 is a high performance FPGA (Field Programmable Gate Array) chip that is suitable for a variety of applications, such as high-performance digital signal processing, embedded processing, and image processing. It is designed to be programmed using a hardware description language (HDL) such as Verilog or VHDL. This chip model has a number of advantages that make it attractive to many industries.


First, the EP1K30FI256-1 chip model has a high capacity of up to 256 logic cells, allowing it to handle a wide range of complex tasks. It also has a wide range of I/O options, making it suitable for a variety of applications. Additionally, the chip model has a fast clock speed and low power consumption, making it an ideal choice for high-performance applications.


The demand for the EP1K30FI256-1 chip model is expected to increase in the future as more industries adopt FPGA technology. This chip model is especially attractive to industries that require high-performance, low-power solutions such as automotive, aerospace, and medical. Additionally, the chip model is suitable for use in the development of intelligent robots, as it can be programmed to perform complex tasks quickly and efficiently.


To use the EP1K30FI256-1 chip model effectively, a number of technical skills are required. This includes knowledge of HDL languages such as Verilog and VHDL, as well as an understanding of FPGA technology and its various components. Additionally, knowledge of digital signal processing, embedded processing, and image processing is also beneficial. With the right technical skills, the EP1K30FI256-1 chip model can be used to develop and popularize future intelligent robots.



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