
Altera Corporation
EP1K30FI256-1
EP1K30FI256-1 ECAD Model
EP1K30FI256-1 Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 2.5 V | |
Propagation Delay | 8 ns | |
Number of Inputs | 171 | |
Number of Outputs | 171 | |
Number of Logic Cells | 1728 | |
Number of Dedicated Inputs | 6 | |
Number of I/O Lines | 171 | |
Programmable Logic Type | LOADABLE PLD | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 6 DEDICATED INPUTS, 171 I/O | |
Clock Frequency-Max | 90 MHz | |
Output Function | REGISTERED | |
Power Supplies | 2.5,2.5/3.3 V | |
Supply Voltage-Max | 2.625 V | |
Supply Voltage-Min | 2.375 V | |
JESD-30 Code | S-PBGA-B256 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | 220 | |
Number of Terminals | 256 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA256,16X16,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 17 mm | |
Length | 17 mm | |
Seated Height-Max | 2.1 mm | |
Ihs Manufacturer | ALTERA CORP | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
Part Package Code | BGA | |
Package Description | BGA, BGA256,16X16,40 | |
Pin Count | 256 |
EP1K30FI256-1 Datasheet Download
EP1K30FI256-1 Overview
The chip model EP1K30FI256-1 is a high performance FPGA (Field Programmable Gate Array) chip that is suitable for a variety of applications, such as high-performance digital signal processing, embedded processing, and image processing. It is designed to be programmed using a hardware description language (HDL) such as Verilog or VHDL. This chip model has a number of advantages that make it attractive to many industries.
First, the EP1K30FI256-1 chip model has a high capacity of up to 256 logic cells, allowing it to handle a wide range of complex tasks. It also has a wide range of I/O options, making it suitable for a variety of applications. Additionally, the chip model has a fast clock speed and low power consumption, making it an ideal choice for high-performance applications.
The demand for the EP1K30FI256-1 chip model is expected to increase in the future as more industries adopt FPGA technology. This chip model is especially attractive to industries that require high-performance, low-power solutions such as automotive, aerospace, and medical. Additionally, the chip model is suitable for use in the development of intelligent robots, as it can be programmed to perform complex tasks quickly and efficiently.
To use the EP1K30FI256-1 chip model effectively, a number of technical skills are required. This includes knowledge of HDL languages such as Verilog and VHDL, as well as an understanding of FPGA technology and its various components. Additionally, knowledge of digital signal processing, embedded processing, and image processing is also beneficial. With the right technical skills, the EP1K30FI256-1 chip model can be used to develop and popularize future intelligent robots.
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