
Altera Corporation
EP1K10FI256-1
EP1K10FI256-1 ECAD Model
EP1K10FI256-1 Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 2.5 V | |
Propagation Delay | 7.5 ns | |
Number of Inputs | 136 | |
Number of Outputs | 136 | |
Number of Logic Cells | 576 | |
Number of Dedicated Inputs | 6 | |
Number of I/O Lines | 130 | |
Programmable Logic Type | LOADABLE PLD | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 6 DEDICATED INPUTS, 130 I/O | |
Clock Frequency-Max | 90 MHz | |
Output Function | REGISTERED | |
Power Supplies | 2.5,2.5/3.3 V | |
Supply Voltage-Max | 2.625 V | |
Supply Voltage-Min | 2.375 V | |
JESD-30 Code | S-PBGA-B256 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | 220 | |
Number of Terminals | 256 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA256,16X16,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 17 mm | |
Length | 17 mm | |
Seated Height-Max | 2.1 mm | |
Ihs Manufacturer | ALTERA CORP | |
Package Description | BGA, BGA256,16X16,40 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
Part Package Code | BGA | |
Pin Count | 256 |
EP1K10FI256-1 Datasheet Download
EP1K10FI256-1 Overview
The chip model EP1K10FI256-1 has become a popular choice for many networked applications. It is a FPGA-based integrated circuit, which provides a wide range of features and capabilities. It is designed to provide the flexibility and performance needed for a variety of applications, including communication, industrial automation, medical imaging, and robotics.
The EP1K10FI256-1 is designed to provide the necessary performance and flexibility needed for a variety of applications. It is designed to support high-speed data transfer and communication, and has the ability to integrate multiple functions into a single device. This makes it ideal for applications such as industrial automation, medical imaging, and robotics.
The EP1K10FI256-1 is also designed to be used in the era of fully intelligent systems. It is designed to provide the necessary processing power to enable intelligent systems to process data quickly and accurately. This makes it ideal for the development and popularization of future intelligent robots.
The product description and specific design requirements of the EP1K10FI256-1 are detailed in the manufacturer's documentation. It is important to understand the product specifications and design requirements before attempting to use the chip model. In addition, actual case studies and precautions should be taken into account when using the EP1K10FI256-1.
Using the EP1K10FI256-1 effectively requires a certain level of technical knowledge and expertise. It is important to understand the programming language and the necessary tools and techniques for programming the chip model. In addition, it is important to understand the various features and capabilities of the chip model, and the best ways to utilize them.
In conclusion, the EP1K10FI256-1 is an ideal chip model for many networked applications. It is designed to provide the necessary performance and flexibility needed for a variety of applications, including communication, industrial automation, medical imaging, and robotics. It is also designed to be used in the era of fully intelligent systems, making it ideal for the development and popularization of future intelligent robots. However, it is important to understand the product description and specific design requirements of the EP1K10FI256-1, as well as actual case studies and precautions, before attempting to use the chip model. In addition, it is important to have a certain level of technical knowledge and expertise to use the chip model effectively.
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