Altera Corporation
EP1K100FI256-3
EP1K100FI256-3 ECAD Model
EP1K100FI256-3 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Propagation Delay | 16 ns | |
| Number of Inputs | 333 | |
| Number of Outputs | 333 | |
| Number of Logic Cells | 4992 | |
| Number of Dedicated Inputs | 6 | |
| Number of I/O Lines | 186 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 6 DEDICATED INPUTS, 186 I/O | |
| Output Function | REGISTERED | |
| Power Supplies | 2.5,2.5/3.3 V | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 220 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 2.1 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA256,16X16,40 | |
| Pin Count | 256 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP1K100FI256-3 Datasheet Download
EP1K100FI256-3 Overview
The chip model EP1K100FI256-3 is a popular model in the semiconductor industry and has been widely used in various applications. It is a low-power, high-performance FPGA that is designed to meet the needs of modern embedded systems. This chip model has been widely adopted due to its ability to meet the requirements of a wide range of applications, including communication, networking, and multimedia.
The industry trends for this chip model are constantly evolving and new technologies are being developed to support the application environment. The original design intention of the chip model EP1K100FI256-3 was to provide a reliable, cost-effective solution for embedded systems. This model has the potential for future upgrades and can be applied to advanced communication systems.
The chip model EP1K100FI256-3 can also be used in the development and popularization of future intelligent robots. It has the potential to be used in a variety of applications, such as navigation, motion control, and voice recognition. To use the chip model effectively, it is important to have the right technical talent. This includes having the skills to design and develop the necessary hardware and software components, and to understand the underlying principles of the chip model.
In conclusion, the chip model EP1K100FI256-3 is a popular model in the semiconductor industry and has the potential to be used in a variety of applications. Its industry trends are constantly evolving, and new technologies are being developed to support the application environment. It has the potential to be used in the development and popularization of future intelligent robots, but it is important to have the right technical talent in order to use the chip model effectively.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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