EP1K100FI256-1
EP1K100FI256-1
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rohs

Altera Corporation

EP1K100FI256-1


EP1K100FI256-1
F53-EP1K100FI256-1
Active
LOADABLE PLD, 9 ns, CMOS, BGA, BGA256,16X16,40
BGA, BGA256,16X16,40

EP1K100FI256-1 ECAD Model


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EP1K100FI256-1 Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 2.5 V
Propagation Delay 9 ns
Number of Inputs 333
Number of Outputs 333
Number of Logic Cells 4992
Number of Dedicated Inputs 6
Number of I/O Lines 186
Programmable Logic Type LOADABLE PLD
Temperature Grade INDUSTRIAL
Package Shape SQUARE
Technology CMOS
Organization 6 DEDICATED INPUTS, 186 I/O
Clock Frequency-Max 90 MHz
Output Function REGISTERED
Power Supplies 2.5,2.5/3.3 V
Supply Voltage-Max 2.625 V
Supply Voltage-Min 2.375 V
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 220
Number of Terminals 256
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA256,16X16,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 17 mm
Length 17 mm
Seated Height-Max 2.1 mm
Ihs Manufacturer ALTERA CORP
Package Description BGA, BGA256,16X16,40
Reach Compliance Code compliant
HTS Code 8542.39.00.01
Part Package Code BGA
Pin Count 256

EP1K100FI256-1 Datasheet Download


EP1K100FI256-1 Overview



The chip model EP1K100FI256-1 is a high-performance Field Programmable Gate Array (FPGA) designed for digital signal processing, embedded processing, and image processing. This chip model is ideal for applications that require the use of HDL language, such as network and intelligent systems.


The EP1K100FI256-1 is a powerful and reliable chip model that is capable of delivering high-performance results in a wide range of applications. It has an impressive array of features, such as a large number of programmable logic elements, high-speed memory, and a wide range of I/O pins. This chip model also has an advanced clock management system and a power-efficient design.


In terms of applications, the EP1K100FI256-1 is suitable for a variety of tasks, including high-performance digital signal processing, embedded processing, image processing, and more. It is highly versatile and can be used in a variety of scenarios, including network and intelligent systems. In the era of fully intelligent systems, the chip model can be used to provide the necessary processing power for data-intensive tasks.


When it comes to product design, the EP1K100FI256-1 is designed to be highly reliable and efficient. Its design includes multiple layers of protection against power surges, and it is also equipped with a range of safety features. Additionally, the chip model has a wide range of programmable logic elements, allowing for the implementation of complex algorithms and functions.


In order to ensure the successful implementation of the chip model, there are a few key considerations that should be taken into account. For example, it is important to ensure that the design meets the specific requirements of the application. Additionally, it is important to ensure that the chip model is used in accordance with the manufacturer's instructions and that it is properly tested and verified before being deployed.


In conclusion, the EP1K100FI256-1 is a powerful and reliable chip model that is suitable for a wide range of applications, including high-performance digital signal processing, embedded processing, image processing, and more. It is highly versatile and can be used in a variety of scenarios, including network and intelligent systems. When it comes to product design, it is important to ensure that the design meets the specific requirements of the application and that the chip model is used in accordance with the manufacturer's instructions.



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