Altera Corporation
EP1C4F324I6
EP1C4F324I6 ECAD Model
EP1C4F324I6 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 249 | |
| Number of Outputs | 249 | |
| Number of Logic Cells | 4000 | |
| Number of CLBs | 400 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Organization | 400 CLBS | |
| Clock Frequency-Max | 405 MHz | |
| Power Supplies | 1.5,1.5/3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B324 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Number of Terminals | 324 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA324,18X18,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 19 mm | |
| Length | 19 mm | |
| Seated Height-Max | 2.2 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | 19 X 19 MM, 1.0 MM PITCH, FBGA-324 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP1C4F324I6 Overview
The chip model EP1C4F324I6 is an integrated circuit (IC) designed by Altera Corporation that is suitable for high-performance digital signal processing, embedded processing, image processing, and other applications. It is based on the MAX V CPLD architecture, which is a high-speed, low-power, non-volatile programmable logic device (PLD). The chip model EP1C4F324I6 is designed to be used in conjunction with a HDL language, such as VHDL, Verilog, or SystemVerilog, for easy programming and development.
The EP1C4F324I6 chip model has numerous advantages, including low power consumption, high speed, and high density. It is also very reliable and has a wide operating temperature range. It also features a wide range of I/O, making it suitable for many applications. In addition, the chip model is highly configurable and can be adapted to meet specific design requirements.
The EP1C4F324I6 chip model is expected to be in high demand in the future, particularly in the fields of digital signal processing, embedded processing, and image processing. This is due to its high performance, low power consumption, and reliability. Furthermore, its wide range of I/O makes it suitable for a variety of applications.
The EP1C4F324I6 chip model has specific design requirements that must be met in order to ensure its proper functioning. This includes the need for a proper power supply, the correct programming language, and the correct configuration of the chip. Additionally, the chip must be properly tested and verified before it is used in any application.
There are numerous case studies available that demonstrate the successful implementation of the EP1C4F324I6 chip model in various applications. These studies provide valuable insight into the design and implementation of the chip, as well as the precautions that must be taken in order to ensure its proper functioning.
In conclusion, the EP1C4F324I6 chip model is an excellent choice for high-performance digital signal processing, embedded processing, and image processing applications. It has numerous advantages, including low power consumption, high speed, and high density. It is expected to be in high demand in the future, and its specific design requirements must be met in order to ensure its proper functioning. Numerous case studies are available that demonstrate the successful implementation of the chip, as well as the precautions that must be taken in order to ensure its proper functioning.
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| QTY | Unit Price | Ext Price |
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