Altera Corporation
EP1C3T100I6
EP1C3T100I6 ECAD Model
EP1C3T100I6 Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| JESD-609 Code | e0 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Number of Terminals | 100 | |
| Package Code | TFQFP | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Pitch | 500 µm | |
| Length | 14 mm | |
| Seated Height-Max | 1.2 mm | |
| Width | 14 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Package Description | TFQFP, TQFP100,.63SQ | |
| Reach Compliance Code | compliant | |
| Part Package Code | QFP | |
| Pin Count | 100 | |
| HTS Code | 8542.39.00.01 | |
| Clock Frequency-Max | 405 MHz | |
| JESD-30 Code | S-PQFP-G100 | |
| Moisture Sensitivity Level | 3 | |
| Number of CLBs | 291 | |
| Number of Inputs | 65 | |
| Number of Logic Cells | 2910 | |
| Number of Outputs | 65 | |
| Organization | 291 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Equivalence Code | TQFP100,.63SQ | |
| Peak Reflow Temperature (Cel) | 220 | |
| Power Supplies | 1.5,1.5/3.3 V | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| Supply Voltage-Nom | 1.5 V | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | GULL WING | |
| Terminal Position | QUAD |
EP1C3T100I6 Datasheet Download
EP1C3T100I6 Overview
The chip model EP1C3T100I6 is a relatively new and advanced model developed by Altera Corporation. It is a high-performance, low-power FPGA device that is ideal for a wide range of applications. It offers a high-speed, low-power solution for a variety of applications, such as embedded systems, communication systems, automotive applications, and industrial control systems.
The EP1C3T100I6 is a low-cost, low-power, and high-performance device that is suitable for a wide range of applications. It is designed with a flexible architecture that allows for easy customization and scalability. It is also designed with a high-speed interface, allowing it to be used in high-speed communication systems. Additionally, the device is designed with a low-power consumption, making it ideal for applications that require low power consumption.
The EP1C3T100I6 offers a number of advantages over other chip models. It is designed with a high-speed interface that allows it to be used in high-speed communication systems. Additionally, the device is designed with a low-power consumption, making it ideal for applications that require low power consumption. Additionally, the device is designed with a flexible architecture that allows for easy customization and scalability.
The EP1C3T100I6 is expected to be in high demand in the future due to its versatility and low-power consumption. It is ideal for a wide range of applications, such as embedded systems, communication systems, automotive applications, and industrial control systems. Additionally, the device is designed with a flexible architecture that allows for easy customization and scalability. This makes it ideal for applications that require customization and scalability.
The original design intention of the EP1C3T100I6 was to provide a low-cost, low-power, and high-performance device that is suitable for a wide range of applications. It is designed with a high-speed interface, allowing it to be used in high-speed communication systems. Additionally, the device is designed with a low-power consumption, making it ideal for applications that require low power consumption. Additionally, the device is designed with a flexible architecture that allows for easy customization and scalability.
The EP1C3T100I6 is capable of being upgraded in the future to meet the needs of more advanced communication systems. It is designed with a high-speed interface, allowing it to be used in high-speed communication systems. Additionally, the device is designed with a low-power consumption, making it ideal for applications that require low power consumption. Additionally, the device is designed with a flexible architecture that allows for easy customization and scalability. This allows for the device to be upgraded and adapted to meet the needs of more advanced communication systems.
The product description and specific design requirements of the EP1C3T100I6 are outlined in the product documentation. It is designed with a high-speed interface, allowing it to be used in high-speed communication systems. Additionally, the device is designed with a low-power consumption, making it ideal for applications that require low power consumption. Additionally, the device is designed with a flexible architecture that allows for easy customization and scalability.
To ensure the optimal performance of the EP1C3T100I6, it is important to follow the design requirements outlined in the product documentation. Additionally, actual case studies and precautions should be taken into account when using the device. For example, it is important to ensure that the device is properly cooled and that the power supply is adequate for the task. Additionally, it is important to ensure that the device is properly configured and that any necessary software updates are applied.
In conclusion, the EP1C3T100I6 is a low-cost, low-power, and high-performance device that is suitable for a wide range of applications. It is designed with a high-speed interface, allowing it to be used in high-speed communication systems. Additionally, the device is designed with a low-power consumption, making it ideal for applications that require low power consumption. Additionally, the device is designed with a flexible architecture that allows for easy customization and scalability. This makes it ideal for applications that require customization and scalability. It is expected to be in high demand in the future due to its versatility and low-power consumption. It is important to follow the design requirements outlined in the product documentation and to take actual case studies and precautions into account when using the device.
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