Altera Corporation
EP1210JM
EP1210JM ECAD Model
EP1210JM Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Propagation Delay | 90 ns | |
| Number of Inputs | 36 | |
| Number of Outputs | 24 | |
| Number of Dedicated Inputs | 12 | |
| Number of I/O Lines | 24 | |
| Programmable Logic Type | UV PLD | |
| Temperature Grade | MILITARY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 12 DEDICATED INPUTS, 24 I/O | |
| Additional Feature | 28 MACROCELLS | |
| Architecture | PAL-TYPE | |
| Clock Frequency-Max | 17.5 MHz | |
| Number of Product Terms | 236 | |
| Output Function | MACROCELL | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| JESD-30 Code | S-GQCC-J44 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Peak Reflow Temperature (Cel) | 220 | |
| Number of Terminals | 44 | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | WQCCJ | |
| Package Equivalence Code | LDCC44,.7SQ | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER, WINDOW | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | J BEND | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | QUAD | |
| Width | 16.51 mm | |
| Length | 16.51 mm | |
| Seated Height-Max | 4.57 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Part Package Code | LCC | |
| Package Description | WQCCJ, LDCC44,.7SQ | |
| Pin Count | 44 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.39.00.01 |
EP1210JM Datasheet Download
EP1210JM Overview
The chip model EP1210JM is a revolutionary new product that is set to revolutionize the chip industry. It is designed to be used in networks and intelligent scenarios, and is capable of supporting the latest technologies. This chip model is designed to provide users with the best possible performance, reliability, and flexibility.
The chip model EP1210JM is designed to be used in networks and intelligent scenarios, and is capable of supporting the latest technologies. It is designed to be used in a variety of applications, including data processing, communication, and storage. It is also capable of providing support for the latest technologies, such as artificial intelligence and machine learning.
The product description of the chip model EP1210JM is comprehensive, and includes the following features: it is designed to be used in networks and intelligent scenarios; it is capable of supporting the latest technologies; it is designed to provide users with the best possible performance, reliability, and flexibility; and it is capable of providing support for the latest technologies, such as artificial intelligence and machine learning.
The chip model EP1210JM is also capable of being used in the era of fully intelligent systems. It is designed to be used in a variety of applications, including data processing, communication, and storage. It is also capable of providing support for the latest technologies, such as artificial intelligence and machine learning. This chip model is designed to provide users with the best possible performance, reliability, and flexibility.
Case studies and precautions should be taken into consideration when using the chip model EP1210JM. It is important to understand the product description, design requirements, and potential applications before using the chip model. It is also important to understand the potential risks associated with using the chip model. Additionally, it is important to ensure that the chip model is compatible with the environment and application in which it is being used.
In conclusion, the chip model EP1210JM is a revolutionary new product that is set to revolutionize the chip industry. It is designed to be used in networks and intelligent scenarios, and is capable of supporting the latest technologies. It is designed to provide users with the best possible performance, reliability, and flexibility. Additionally, it is capable of being used in the era of fully intelligent systems. It is important to understand the product description, design requirements, and potential applications before using the chip model, as well as the potential risks associated with using the chip model.
