Altera Corporation
EP1210DM883B
EP1210DM883B ECAD Model
EP1210DM883B Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Propagation Delay | 90 ns | |
| Number of Inputs | 36 | |
| Number of Outputs | 24 | |
| Number of Dedicated Inputs | 12 | |
| Number of I/O Lines | 24 | |
| Programmable Logic Type | UV PLD | |
| Screening Level | 38535Q/M;38534H;883B | |
| Temperature Grade | MILITARY | |
| Package Shape | RECTANGULAR | |
| Technology | CMOS | |
| Organization | 12 DEDICATED INPUTS, 24 I/O | |
| Additional Feature | 28 MACROCELLS | |
| Architecture | PAL-TYPE | |
| Clock Frequency-Max | 17.5 MHz | |
| Number of Product Terms | 236 | |
| Output Function | MACROCELL | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| JESD-30 Code | R-GDIP-T40 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Peak Reflow Temperature (Cel) | 220 | |
| Number of Terminals | 40 | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | WDIP | |
| Package Equivalence Code | DIP40,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE, WINDOW | |
| Surface Mount | NO | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm | |
| Length | 52.07 mm | |
| Seated Height-Max | 5.715 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Part Package Code | DIP | |
| Package Description | WDIP, DIP40,.6 | |
| Pin Count | 40 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.39.00.01 |
EP1210DM883B Datasheet Download
EP1210DM883B Overview
The EP1210DM883B chip model is a powerful and versatile model designed for high-performance digital signal processing, embedded processing, and image processing. It is developed with HDL language, which provides a reliable foundation for the chip to be used in a variety of applications. The chip model offers a range of advantages, including high speed, low power consumption, and excellent flexibility.
The chip model is expected to be increasingly used in the future, especially in the fields of artificial intelligence, machine learning, and robotics. With the rapid development of these industries, the demand for the EP1210DM883B chip model will continue to grow. In addition, the chip model is also expected to be used in networks and intelligent scenarios. With the development of 5G technology, the chip model can be used in the era of fully intelligent systems, providing a reliable and efficient platform for the development of intelligent systems.
In conclusion, the EP1210DM883B chip model is an excellent choice for high-performance digital signal processing, embedded processing, and image processing. It offers a range of advantages, and is expected to be increasingly used in the future in various industries. It is also suitable for use in networks and intelligent scenarios, and can be used in the era of fully intelligent systems.
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5,207 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $4.3747 | $4.3747 |
| 10+ | $4.3277 | $43.2768 |
| 100+ | $4.0925 | $409.2480 |
| 1000+ | $3.8573 | $1,928.6400 |
| 10000+ | $3.5280 | $3,528.0000 |
| The price is for reference only, please refer to the actual quotation! | ||