5SGXEA3K3F35C2
5SGXEA3K3F35C2
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

Altera Corporation

5SGXEA3K3F35C2


5SGXEA3K3F35C2
F53-5SGXEA3K3F35C2
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, FBGA-1152
FBGA-1152

5SGXEA3K3F35C2 ECAD Model


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5SGXEA3K3F35C2 Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Active
Supply Voltage-Nom 900 mV
Number of Inputs 432
Number of Outputs 432
Number of Logic Cells 340000
Number of CLBs 12830
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 12830 CLBS
Power Supplies 0.85,1.5,2.5,2.5/3,1.2/3 V
Supply Voltage-Max 930 mV
Supply Voltage-Min 870 mV
JESD-30 Code S-PBGA-B1152
Qualification Status Not Qualified
Operating Temperature-Max 85 °C
Number of Terminals 1152
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1152,34X34,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 35 mm
Length 35 mm
Seated Height-Max 3.6 mm
Ihs Manufacturer INTEL CORP
Package Description FBGA-1152
Reach Compliance Code compliant
HTS Code 8542.39.00.01

5SGXEA3K3F35C2 Overview



The chip model 5SGXEA3K3F35C2 is a powerful and reliable device designed to meet the needs of various industries. It is an advanced field-programmable gate array (FPGA) that provides advanced features such as a high-performance embedded processor, high-speed transceivers, and an integrated memory controller. This chip model can be used in a wide range of applications, ranging from consumer electronics and industrial automation to medical and aerospace applications.


The chip model 5SGXEA3K3F35C2 provides a number of advantages over other chip models. It has a high-performance embedded processor, which enables the chip to process data quickly and accurately. Additionally, the chip model features high-speed transceivers, which allow for a fast and secure communication between the chip and other devices. The integrated memory controller enables the chip to store and access large amounts of data quickly and efficiently.


The chip model 5SGXEA3K3F35C2 is expected to be in high demand in the future, as it is suitable for a variety of applications. For example, it can be used in medical applications to monitor patient data, as well as in industrial automation to enable efficient and accurate production processes. In addition, the chip model is suitable for use in aerospace applications, as it is capable of handling the high-speed data transfer and processing required for such applications.


The product description and design requirements of the chip model 5SGXEA3K3F35C2 are detailed in the product specifications. The specifications include the chip model’s physical dimensions, power requirements, and operating temperature range. Additionally, the product description outlines the features of the chip model, such as the embedded processor, high-speed transceivers, and integrated memory controller.


The application environment of the chip model 5SGXEA3K3F35C2 should be considered when determining the specific technologies needed to support the chip. For example, if the application requires a high-speed data transfer, then the chip model should be configured to support the necessary data transfer rate. Additionally, if the application requires a high-performance embedded processor, then the chip model should be configured to support the necessary processing capabilities.


Actual case studies and precautions should also be taken into account when determining the specific technologies needed to support the chip model 5SGXEA3K3F35C2. For example, if the chip model is being used in an industrial automation application, then it is important to ensure that the chip model is configured to support the necessary safety protocols. Additionally, if the chip model is being used in an aerospace application, then it is important to ensure that the chip model is configured to support the necessary flight control systems.


In conclusion, the chip model 5SGXEA3K3F35C2 is a powerful and reliable device that can be used in a wide range of applications. It provides a number of advantages over other chip models, and is expected to be in high demand in the future. The product description and design requirements of the chip model should be considered when determining the specific technologies needed to support the chip. Additionally, actual case studies and precautions should be taken into account when determining the specific technologies needed to support the chip model.



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