Altera Corporation
5M2210ZF324C5
5M2210ZF324C5 ECAD Model
5M2210ZF324C5 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.8 V | |
| Propagation Delay | 11.2 ns | |
| Number of Inputs | 271 | |
| Number of Outputs | 271 | |
| Number of Macro Cells | 1700 | |
| Number of I/O Lines | 271 | |
| Programmable Logic Type | FLASH PLD | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 271 I/O | |
| Additional Feature | YES | |
| Clock Frequency-Max | 201.1 MHz | |
| In-System Programmable | YES | |
| JTAG BST | YES | |
| Output Function | MACROCELL | |
| Power Supplies | 1.8,1.2/3.3 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B324 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 324 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA324,18X18,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 19 mm | |
| Length | 19 mm | |
| Seated Height-Max | 1.55 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | 19 X 19 MM, 1 MM PITCH, FBGA-324 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
5M2210ZF324C5 Overview
The chip model 5M2210ZF324C5 is a high-performance digital signal processor, embedded processor, and image processor that uses the HDL language. It is designed to meet the needs of high-performance applications in a variety of industries, such as telecommunications, automotive, medical, and aerospace.
The 5M2210ZF324C5 is designed to be highly flexible, allowing for upgrades and modifications to meet the changing needs of the industry. It is capable of being used in advanced communication systems, as well as other applications that require the use of new technologies.
The chip model 5M2210ZF324C5 is designed to provide high performance, flexibility, and scalability. It utilizes a powerful architecture and advanced design techniques to ensure that it can meet the needs of the industry in the future. The chip model is also designed to be upgradeable, allowing for modifications and upgrades to meet the changing needs of the industry.
The chip model 5M2210ZF324C5 is designed to be versatile and to be able to meet the needs of a variety of industries. It is capable of handling a wide range of tasks, from basic digital signal processing to complex image processing. The chip model is also designed to be able to support new technologies, such as the use of FPGAs and other advanced technologies.
The 5M2210ZF324C5 is designed to provide high performance, flexibility, and scalability. It is designed to be upgradeable, allowing for modifications and upgrades to meet the changing needs of the industry. The chip model is also designed to be able to support new technologies, such as the use of FPGAs and other advanced technologies.
The chip model 5M2210ZF324C5 is designed to provide a high level of performance, flexibility, and scalability. It is designed to be capable of handling a wide range of tasks, from basic digital signal processing to complex image processing. The chip model is also designed to be able to support new technologies, such as the use of FPGAs and other advanced technologies.
The 5M2210ZF324C5 is designed to meet the needs of the industry, both now and in the future. It is designed to be highly flexible, allowing for upgrades and modifications to meet the changing needs of the industry. It is capable of being used in advanced communication systems, as well as other applications that require the use of new technologies.
The chip model 5M2210ZF324C5 is designed to provide a high level of performance, flexibility, and scalability. It is designed to be upgradeable, allowing for modifications and upgrades to meet the changing needs of the industry. By utilizing the HDL language, it is capable of handling a wide range of tasks, from basic digital signal processing to complex image processing. The chip model is also designed to be able to support new technologies, such as the use of FPGAs and other advanced technologies.
The 5M2210ZF324C5 is designed to be a versatile and powerful processor that can meet the needs of the industry, both now and in the future. It is designed to be highly flexible, allowing for upgrades and modifications to meet the changing needs of the industry. It is capable of being used in advanced communication systems, as well as other applications that require the use of new technologies. The chip model is also designed to be able to support new technologies, such as the use of FPGAs and other advanced technologies.
You May Also Be Interested In
4,256 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||