
Altera Corporation
5CEFA9F27C6N
5CEFA9F27C6N ECAD Model
5CEFA9F27C6N Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Supply Voltage-Nom | 1.1 V | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Supply Voltage-Max | 1.13 V | |
Supply Voltage-Min | 1.07 V | |
JESD-30 Code | S-PBGA-B672 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 672 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 27 mm | |
Length | 27 mm | |
Seated Height-Max | 2 mm | |
Ihs Manufacturer | ALTERA CORP | |
Package Description | BGA, | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
Part Package Code | BGA | |
Pin Count | 672 |
5CEFA9F27C6N Datasheet Download
5CEFA9F27C6N Overview
Chip model 5CEFA9F27C6N is a revolutionary new chip designed to meet the needs of modern communication systems. This chip is designed to enable faster, more efficient communication between devices and networks, making it a great choice for businesses and consumers alike.
The chip model 5CEFA9F27C6N offers many advantages over traditional chips, including a faster transmission rate, improved energy efficiency, and enhanced security. It is also designed to be compatible with a wide range of communication systems, making it an ideal choice for businesses and consumers. With its improved performance, the chip model 5CEFA9F27C6N is expected to become increasingly popular in the coming years.
The original design intention of the chip model 5CEFA9F27C6N was to provide a reliable and secure data transmission platform for communication systems. The chip was designed with the latest technologies and is capable of handling large amounts of data. It is also designed to be upgradable, allowing it to keep up with the latest trends in communication systems. Furthermore, the chip model 5CEFA9F27C6N is designed to be compatible with a wide range of communication systems, making it a great choice for businesses and consumers.
The chip model 5CEFA9F27C6N is expected to be increasingly used in networks and intelligent scenarios in the future. It is designed to be able to handle a wide range of data types, making it an ideal choice for networks and intelligent systems. Furthermore, the chip model 5CEFA9F27C6N is designed to be upgradable, allowing it to keep up with the latest trends in communication systems. This makes it a great choice for businesses and consumers looking for reliable and secure data transmission platforms.
The chip model 5CEFA9F27C6N is expected to be increasingly used in the era of fully intelligent systems. It is designed to be able to handle a wide range of data types, making it an ideal choice for networks and intelligent systems. Furthermore, the chip model 5CEFA9F27C6N is designed to be upgradable, allowing it to keep up with the latest trends in communication systems. This makes it a great choice for businesses and consumers looking for reliable and secure data transmission platforms.
In conclusion, the chip model 5CEFA9F27C6N is a revolutionary new chip designed to meet the needs of modern communication systems. It offers many advantages over traditional chips, including a faster transmission rate, improved energy efficiency, and enhanced security. Furthermore, it is designed to be upgradable and compatible with a wide range of communication systems, making it an ideal choice for businesses and consumers. With its improved performance, the chip model 5CEFA9F27C6N is expected to become increasingly popular in the coming years and is expected to be increasingly used in networks and intelligent scenarios in the future.
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