5CEFA9F27C6N
5CEFA9F27C6N
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

Altera Corporation

5CEFA9F27C6N


5CEFA9F27C6N
F53-5CEFA9F27C6N
Active
FIELD PROGRAMMABLE GATE ARRAY, BGA
BGA

5CEFA9F27C6N ECAD Model


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5CEFA9F27C6N Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Transferred
Supply Voltage-Nom 1.1 V
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Supply Voltage-Max 1.13 V
Supply Voltage-Min 1.07 V
JESD-30 Code S-PBGA-B672
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Terminals 672
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 27 mm
Length 27 mm
Seated Height-Max 2 mm
Ihs Manufacturer ALTERA CORP
Package Description BGA,
Reach Compliance Code compliant
HTS Code 8542.39.00.01
Part Package Code BGA
Pin Count 672

5CEFA9F27C6N Datasheet Download


5CEFA9F27C6N Overview



Chip model 5CEFA9F27C6N is a revolutionary new chip designed to meet the needs of modern communication systems. This chip is designed to enable faster, more efficient communication between devices and networks, making it a great choice for businesses and consumers alike.


The chip model 5CEFA9F27C6N offers many advantages over traditional chips, including a faster transmission rate, improved energy efficiency, and enhanced security. It is also designed to be compatible with a wide range of communication systems, making it an ideal choice for businesses and consumers. With its improved performance, the chip model 5CEFA9F27C6N is expected to become increasingly popular in the coming years.


The original design intention of the chip model 5CEFA9F27C6N was to provide a reliable and secure data transmission platform for communication systems. The chip was designed with the latest technologies and is capable of handling large amounts of data. It is also designed to be upgradable, allowing it to keep up with the latest trends in communication systems. Furthermore, the chip model 5CEFA9F27C6N is designed to be compatible with a wide range of communication systems, making it a great choice for businesses and consumers.


The chip model 5CEFA9F27C6N is expected to be increasingly used in networks and intelligent scenarios in the future. It is designed to be able to handle a wide range of data types, making it an ideal choice for networks and intelligent systems. Furthermore, the chip model 5CEFA9F27C6N is designed to be upgradable, allowing it to keep up with the latest trends in communication systems. This makes it a great choice for businesses and consumers looking for reliable and secure data transmission platforms.


The chip model 5CEFA9F27C6N is expected to be increasingly used in the era of fully intelligent systems. It is designed to be able to handle a wide range of data types, making it an ideal choice for networks and intelligent systems. Furthermore, the chip model 5CEFA9F27C6N is designed to be upgradable, allowing it to keep up with the latest trends in communication systems. This makes it a great choice for businesses and consumers looking for reliable and secure data transmission platforms.


In conclusion, the chip model 5CEFA9F27C6N is a revolutionary new chip designed to meet the needs of modern communication systems. It offers many advantages over traditional chips, including a faster transmission rate, improved energy efficiency, and enhanced security. Furthermore, it is designed to be upgradable and compatible with a wide range of communication systems, making it an ideal choice for businesses and consumers. With its improved performance, the chip model 5CEFA9F27C6N is expected to become increasingly popular in the coming years and is expected to be increasingly used in networks and intelligent scenarios in the future.



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