Altera Corporation
5ASXMB3E4F31I3
5ASXMB3E4F31I3 ECAD Model
5ASXMB3E4F31I3 Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 1.15 V | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Clock Frequency-Max | 670 MHz | |
| Supply Voltage-Max | 1.18 V | |
| Supply Voltage-Min | 1.12 V | |
| JESD-30 Code | S-PBGA-B896 | |
| JESD-609 Code | e0 | |
| Number of Terminals | 896 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 31 mm | |
| Length | 31 mm | |
| Seated Height-Max | 2.7 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Part Package Code | BGA | |
| Package Description | BGA, | |
| Pin Count | 896 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
5ASXMB3E4F31I3 Datasheet Download
5ASXMB3E4F31I3 Overview
Chip model 5ASXMB3E4F31I3 is a new chip model from the leading semiconductor manufacturer, designed to provide high performance, low power consumption and scalability. This model is widely used in a variety of applications, ranging from consumer electronics to industrial applications. It is also widely used in communication systems, networks and intelligent scenarios.
The original design intention of the chip model 5ASXMB3E4F31I3 is to provide a high-performance, low-power solution to meet the increasing demands of the market. It is designed with a scalable architecture, allowing it to be adapted to a variety of applications. The chip model is also designed to be upgradeable, allowing it to be easily adapted to the latest technologies.
Regarding the industry trends of the chip model 5ASXMB3E4F31I3 and the future development of related industries, it is possible that new technologies may be needed to support the application environment. For example, new communication protocols may be needed to better support the increasing number of connected devices. Additionally, new intelligent algorithms may be needed to enable the chip model to be used in more advanced scenarios.
The possible future applications of the chip model 5ASXMB3E4F31I3 include networks and intelligent scenarios. In networks, the chip model can be used to enable faster data transmission and better network performance. In intelligent scenarios, the chip model can be used to enable more advanced features, such as facial recognition or object recognition. With the increasing development of artificial intelligence, the chip model 5ASXMB3E4F31I3 may be used in the era of fully intelligent systems.
In conclusion, the chip model 5ASXMB3E4F31I3 is designed to provide high performance, low power consumption and scalability. It is also designed to be upgradeable, allowing it to be adapted to new technologies. The chip model is widely used in a variety of applications, including consumer electronics, communication systems, networks and intelligent scenarios. It is possible that new technologies may be needed to support the application environment, and the chip model may be used in the era of fully intelligent systems.
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1,372 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $2,604.1934 | $2,604.1934 |
| 10+ | $2,576.1914 | $25,761.9136 |
| 100+ | $2,436.1810 | $243,618.0960 |
| 1000+ | $2,296.1706 | $1,148,085.2800 |
| 10000+ | $2,100.1560 | $2,100,156.0000 |
| The price is for reference only, please refer to the actual quotation! | ||