Altera Corporation
5AGXBA5D6F27C4N
5AGXBA5D6F27C4N ECAD Model
5AGXBA5D6F27C4N Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 1.1 V | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Clock Frequency-Max | 670 MHz | |
| Supply Voltage-Max | 1.13 V | |
| Supply Voltage-Min | 1.07 V | |
| JESD-30 Code | S-PBGA-B672 | |
| JESD-609 Code | e1 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 672 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.7 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Package Description | BGA, | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | BGA | |
| Pin Count | 672 |
5AGXBA5D6F27C4N Datasheet Download
5AGXBA5D6F27C4N Overview
The chip model 5AGXBA5D6F27C4N is an advanced and reliable integrated circuit designed for various applications. It is the latest in a series of chips developed by a leading semiconductor manufacturer, and it has the potential to revolutionize the industry. This chip model is designed to provide superior performance, reliability, and scalability for a wide range of applications.
The 5AGXBA5D6F27C4N chip model is designed for use in a variety of industries, including telecommunications, automotive, industrial, and consumer electronics. It features a high-performance, low-power architecture that is capable of supporting the latest communication protocols and technologies. This chip model is also designed to be highly reliable and can be used in a variety of different environments.
The 5AGXBA5D6F27C4N chip model has a number of advantages over existing chips, including improved performance, scalability, and reliability. It is also designed to be highly efficient, with a low power draw and a low thermal envelope. In addition, the chip model is designed to be highly scalable, allowing it to be used in a variety of different applications.
The 5AGXBA5D6F27C4N chip model is designed to meet the needs of a wide range of industries, and its features make it an ideal choice for many applications. This chip model is designed to be highly reliable and can be used in a variety of different environments. It is also designed to be highly efficient, with a low power draw and a low thermal envelope.
The 5AGXBA5D6F27C4N chip model is designed to be easily upgradable, allowing for future upgrades and modifications to be made. This chip model is also designed to be highly compatible with advanced communication systems, making it a great choice for those who are looking to upgrade their existing systems.
The 5AGXBA5D6F27C4N chip model is designed to meet the specific requirements of the industries it is intended for. It is designed to be highly reliable and can be used in a variety of different environments. It is also designed to be highly efficient, with a low power draw and a low thermal envelope. In addition, the chip model is designed to be highly scalable, allowing it to be used in a variety of different applications.
The 5AGXBA5D6F27C4N chip model is expected to be in high demand in the coming years, as more and more industries begin to adopt this technology. This chip model is designed to provide superior performance, reliability, and scalability for a wide range of applications, making it an ideal choice for many industries.
In order to ensure the best results, it is important to follow the design requirements for the 5AGXBA5D6F27C4N chip model. This chip model should be installed correctly and in accordance with the manufacturer's instructions. In addition, it is important to take into consideration any potential hazards or risks associated with the installation of the chip model.
The 5AGXBA5D6F27C4N chip model is a reliable and advanced integrated circuit designed for a variety of applications. It is designed to be highly reliable and can be used in a variety of different environments. It is also designed to be highly efficient, with a low power draw and a low thermal envelope. In addition, the chip model is designed to be highly scalable, allowing it to be used in a variety of different applications. This chip model is expected to be in high demand in the coming years, as more and more industries begin to adopt this technology. It is also designed to be easily upgradable, allowing for future upgrades and modifications to be made. In order to ensure the best results, it is important to follow the design requirements for the 5AGXBA5D6F27C4N chip model, and to take into consideration any potential hazards or risks associated with the installation of the chip model.
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4,350 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
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| No reference price found. | ||