Altera Corporation
10CL080YF780C8G
10CL080YF780C8G ECAD Model
10CL080YF780C8G Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.2 V | |
| Number of CLBs | 5079 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Organization | 5079 CLBS | |
| Supply Voltage-Max | 1.25 V | |
| Supply Voltage-Min | 1.15 V | |
| JESD-30 Code | S-PBGA-B780 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 780 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 29 mm | |
| Length | 29 mm | |
| Seated Height-Max | 2.4 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-780 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991 | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Intel |
10CL080YF780C8G Overview
The chip model 10CL080YF780C8G is a highly advanced piece of technology that has been developed to meet the needs of modern communication systems. It is designed to provide a reliable and secure connection for data transmission, as well as to provide a high level of performance. This chip is designed to be used in a wide range of applications, including advanced communication systems, and it is capable of supporting a variety of technologies.
The chip model 10CL080YF780C8G is designed to be able to handle the demands of modern communication systems. It is equipped with the latest technologies to ensure that it can provide a reliable and secure connection for data transmission. It is also designed to be able to handle a variety of different technologies, such as Wi-Fi, Bluetooth, and Ethernet. This chip is also designed to be able to support the latest technologies, such as 5G, so that it can be used in advanced communication systems.
The chip model 10CL080YF780C8G is designed to be able to handle a variety of different technologies, as well as to be able to support the latest technologies. This chip is also designed to be able to handle a variety of different applications, such as advanced communication systems. It is also designed to be able to support a variety of different technologies, such as Wi-Fi, Bluetooth, and Ethernet. This chip is also designed to be able to support the latest technologies, such as 5G, so that it can be used in advanced communication systems.
The chip model 10CL080YF780C8G is designed to be able to handle a variety of different technologies, as well as to be able to support the latest technologies. It is also designed to be able to handle a variety of different applications, such as advanced communication systems. It is also designed to be able to support a variety of different technologies, such as Wi-Fi, Bluetooth, and Ethernet. This chip is also designed to be able to support the latest technologies, such as 5G, so that it can be used in advanced communication systems.
The original design intention of the chip model 10CL080YF780C8G is to provide a reliable and secure connection for data transmission, as well as to provide a high level of performance. The chip is designed to be able to handle a variety of different technologies, as well as to be able to support the latest technologies. It is also designed to be able to handle a variety of different applications, such as advanced communication systems.
When considering the future development of the chip model 10CL080YF780C8G, it is important to consider the industry trends and the application environment. It is important to consider the specific technologies that are needed in order to ensure that the chip is able to handle the demands of modern communication systems. It is also important to consider the possibility of future upgrades, as well as whether the chip is able to be applied to advanced communication systems.
When considering the product description and specific design requirements of the chip model 10CL080YF780C8G, it is important to consider the actual case studies and precautions. It is important to consider the actual case studies and precautions in order to ensure that the chip is able to handle the demands of modern communication systems. It is also important to consider the possibility of future upgrades, as well as whether the chip is able to be applied to advanced communication systems.
In conclusion, the chip model 10CL080YF780C8G is a highly advanced piece of technology that has been designed to provide a reliable and secure connection for data transmission, as well as to provide a high level of performance. It is designed to be able to handle a variety of different technologies, as well as to be able to support the latest technologies. It is also designed to be able to handle a variety of different applications, such as advanced communication systems. When considering the industry trends and the application environment, it is important to consider the specific technologies that are needed in order to ensure that the chip is able to handle the demands of modern communication systems. It is also important to consider the possibility of future upgrades, as well as whether the chip is able to be applied to advanced communication systems. Finally, it is important to consider the actual case studies and precautions in order to ensure that the chip is able to handle the demands of modern communication systems.
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3,136 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $98.7287 | $98.7287 |
| 10+ | $97.6671 | $976.6711 |
| 100+ | $92.3591 | $9,235.9113 |
| 1000+ | $87.0511 | $43,525.5590 |
| 10000+ | $79.6199 | $79,619.9250 |
| The price is for reference only, please refer to the actual quotation! | ||