10AX115R3F40I2LG
10AX115R3F40I2LG
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rohs

Altera Corporation

10AX115R3F40I2LG


10AX115R3F40I2LG
F53-10AX115R3F40I2LG
Active
FIELD PROGRAMMABLE GATE ARRAY, TSMC, BGA, BGA1517,39X39,40
BGA

10AX115R3F40I2LG ECAD Model


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10AX115R3F40I2LG Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Supply Voltage-Nom 900 mV
Number of Inputs 342
Number of Outputs 342
Number of Logic Cells 1150000
Number of CLBs 42720
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade INDUSTRIAL
Package Shape SQUARE
Technology TSMC
Organization 42720 CLBS
Additional Feature ALSO OPERATES AT 0.95V NOMINAL SUPPLY
Power Supplies 900 mV
Supply Voltage-Max 930 mV
Supply Voltage-Min 870 mV
JESD-30 Code S-PBGA-B1517
Qualification Status Not Qualified
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Terminals 1517
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1517,39X39,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 40 mm
Length 40 mm
Seated Height-Max 3.35 mm
Ihs Manufacturer INTEL CORP
Package Description BGA, BGA1517,39X39,40
Reach Compliance Code compliant
HTS Code 8542.39.00.01
Samacsys Manufacturer Intel

10AX115R3F40I2LG Overview



The chip model 10AX115R3F40I2LG is a powerful tool for the advancement of technology. It is a high-performance, low-power chip model that is designed to be used in a range of applications such as networking and intelligent systems. With its advanced features, the chip model 10AX115R3F40I2LG is well-suited for the current and future development of related industries.


The 10AX115R3F40I2LG chip model offers a number of advantages over other chip models. It is designed to be more energy efficient and reliable, while still providing high performance. The chip model also offers a wide range of features that make it well-suited for a variety of applications, including networking and intelligent systems. The chip model is also designed to be compatible with a range of technologies, making it an ideal choice for the current and future development of related industries.


In the current market, the 10AX115R3F40I2LG chip model is expected to be in high demand in the future. This is due to its advanced features and its compatibility with a range of technologies. It is expected to be used in a variety of applications, including networks and intelligent systems. The chip model is also expected to play an important role in the development of the fully intelligent systems of the future.


The 10AX115R3F40I2LG chip model is expected to be used in a variety of applications, including networks and intelligent systems. The chip model is well-suited for the development of intelligent systems, as it is designed to be compatible with a range of technologies. This makes it possible to be used in the era of fully intelligent systems, where it can be used to enable the development of new, more advanced technologies.


In conclusion, the 10AX115R3F40I2LG chip model is a powerful tool for the advancement of technology. It is designed to be more energy efficient and reliable, while still providing high performance. The chip model is expected to be in high demand in the future, as it is designed to be compatible with a range of technologies, making it an ideal choice for the current and future development of related industries. It is also expected to be used in a variety of applications, including networks and intelligent systems, and it is possible to be used in the era of fully intelligent systems.



4,979 In Stock


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Unit Price: $7,972.816
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $7,414.7189 $7,414.7189
10+ $7,334.9907 $73,349.9072
100+ $6,936.3499 $693,634.9920
1000+ $6,537.7091 $3,268,854.5600
10000+ $5,979.6120 $5,979,612.0000
The price is for reference only, please refer to the actual quotation!

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