Altera Corporation
10AX115H3F34E2SG
10AX115H3F34E2SG ECAD Model
10AX115H3F34E2SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 504 | |
| Number of Outputs | 504 | |
| Number of Logic Cells | 1150000 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.65 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Package Description | BGA, BGA1152,34X34,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX115H3F34E2SG Datasheet Download
10AX115H3F34E2SG Overview
The chip model 10AX115H3F34E2SG is a high-performance chip developed by a leading chip manufacturer. It has been widely used in many industries, including communication, networking, and embedded systems. It is designed to provide reliable performance and high-speed data transmission. It is also equipped with advanced features such as high-speed data transmission, low power consumption, and high-speed data processing.
The chip model 10AX115H3F34E2SG is designed to meet the requirements of the latest communication and networking technologies. It is capable of supporting the latest communication protocols such as 4G, 5G, and Wi-Fi. It is also capable of supporting the latest network architectures such as SDN and NFV. Furthermore, it is also able to support advanced technologies such as artificial intelligence, machine learning, and cloud computing.
The chip model 10AX115H3F34E2SG has been designed to be highly flexible and upgradable. It is capable of supporting the latest technologies and protocols, as well as being able to be used in advanced communication systems. It is also capable of being used in networks and intelligent scenarios, making it suitable for the era of fully intelligent systems.
The chip model 10AX115H3F34E2SG is a powerful and reliable chip that is designed to meet the requirements of the latest communication and networking technologies. It is capable of supporting the latest communication protocols and network architectures, as well as being able to be used in advanced communication systems. Furthermore, it is also capable of being used in networks and intelligent scenarios, making it suitable for the era of fully intelligent systems. As such, it is a great choice for those looking for a reliable and powerful chip for their communication and networking needs.
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1,039 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $17,160.1440 | $17,160.1440 |
| 10+ | $16,975.6263 | $169,756.2628 |
| 100+ | $16,053.0379 | $1,605,303.7899 |
| 1000+ | $15,130.4495 | $7,565,224.7570 |
| 10000+ | $13,838.8258 | $13,838,825.7750 |
| The price is for reference only, please refer to the actual quotation! | ||