Altera Corporation
10AX016C3U19I2SG
10AX016C3U19I2SG ECAD Model
10AX016C3U19I2SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 240 | |
| Number of Outputs | 240 | |
| Number of Logic Cells | 160000 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B484 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 484 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FBGA | |
| Package Equivalence Code | BGA484,22X22,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 800 µm | |
| Terminal Position | BOTTOM | |
| Width | 19 mm | |
| Length | 19 mm | |
| Seated Height-Max | 3.25 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Package Description | FBGA, BGA484,22X22,32 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX016C3U19I2SG Datasheet Download
10AX016C3U19I2SG Overview
The chip model 10AX016C3U19I2SG is a high-performance digital signal processor (DSP) designed to meet the needs of embedded processing, image processing, and other high-performance digital signal processing applications. It is designed to be compatible with the HDL language, making it easier to use and integrate into a wide variety of systems. The chip model 10AX016C3U19I2SG provides a number of advantages over traditional signal processors, including faster processing speeds, lower power consumption, and improved signal-to-noise ratio.
The chip model 10AX016C3U19I2SG is expected to be in high demand in the coming years due to its performance and cost-effectiveness. It is ideal for applications that require high-speed processing, such as video processing, audio processing, and image processing. It can also be used for embedded applications, such as medical imaging and autonomous vehicles. The chip model 10AX016C3U19I2SG can also be used in advanced communication systems, such as 5G networks, due to its high-speed processing capabilities.
The original design intention of the chip model 10AX016C3U19I2SG was to provide a cost-effective solution for high-performance digital signal processing applications. It was designed to be compatible with the HDL language, making it easier to use and integrate into a wide variety of systems. The chip model 10AX016C3U19I2SG can be upgraded in the future, allowing it to be used in more advanced applications. Additionally, it can be used in advanced communication systems, such as 5G networks, due to its high-speed processing capabilities.
Overall, the chip model 10AX016C3U19I2SG is an ideal solution for applications that require high-speed digital signal processing. Its compatibility with the HDL language makes it easier to integrate into existing systems, and its performance and cost-effectiveness make it a desirable choice for many applications. Additionally, its ability to be upgraded in the future makes it a suitable choice for advanced communication systems, such as 5G networks.
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3,514 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,823.3877 | $1,823.3877 |
| 10+ | $1,803.7813 | $18,037.8135 |
| 100+ | $1,705.7498 | $170,574.9753 |
| 1000+ | $1,607.7182 | $803,859.0790 |
| 10000+ | $1,470.4739 | $1,470,473.9250 |
| The price is for reference only, please refer to the actual quotation! | ||